Cost-effective and Green Manufacturing Substrate Integrated Waveguide (SIW) BPF for Wireless Sensor Network Applications

This paper presents a comparison between innovative technique for implementation of substrate integrated waveguide band pass filter centered at 4 GHz and conventional PCB results . Two poles filter is designed, simulated and fabricated. The novel fabrication process technique is based on green manufacturing where physical etching of metal layer of aluminum is glued on paper substrate. The pass band filter is composed of two resonant adjacent and symmetric cavities separated by a coupling iris. The same topology is adopted with conventional substrate and PCB technology to validate the new technique results. The bandwidth achieved is almost four times wider than found with PCB technology developed for UWB applications. The proposed technique keeps the advantages of conventional SIW technology including low profile, compact size, complete shielding, easy fabrication, low cost for mass production as well as convenient integration with planar waveguide components including transitions. Moreover, the flexible quality of paper offer the possibility to fabricate conformal shapes of SIW components which is not possible with conventional rigid substrates made with PCB technology . In addition to the advantages of eco friendly, renewable, light weight , and ultra low cost materials. Keywords—Substrate Integrated Waveguide; Band pass filter; Wireless sensor network; green material technology; paper substrate